Dynamic RAM

Because of their widespread use in mainframes PCs and mobile audio and video devices DRAMs are being manufactured in ever increasing volume both in stand-alone and in embedded form as part of a system on chip. Due to the optimum design of their componentsâaccess transistor storage capacitor and peripheralsâDRAMs are the cheapest and densest semiconductor memory currently available. As a result most of DRAM structure research and development focuses on the technology used for its constituent components and their interconnections. However only a few books are available on semiconductor memories in general and fewer on DRAMs. Dynamic RAM: Technology Advancements provides a holistic view of the DRAM technology with a systematic description of the advancements in the field since the 1970s and an analysis of future challenges. Topics Include: DRAM cells of all types including planar three-dimensional (3-D) trench or stacked COB or CUB vertical and mechanically robust cells using advanced transistors and storage capacitors Advancements in transistor technology for the RCAT SCAT FinFET BT FinFET Saddle and advanced recess type and storage capacitor realizations How sub 100 nm trench DRAM technologies and sub 50 nm stacked DRAM technologies and related topics may lead to new research Various types of leakages and power consumption reduction methods in active and sleep mode Various types of SAs and yield enhancement techniques employing ECC and redundancy A worthwhile addition to semiconductor memory research academicians and researchers interested in the design and optimization of high-density and cost-efficient DRAMs may also find it useful as part of a graduate-level course. . Language: English