Style SOP8150mil Overview The SOP8 150 mil package is a standard eightpin surfacemount IC housing designed for compact, reliable integration on printed circuit boards. It uses a plastic encapsulation and provides a standard SOP8 footprint for broad compatibility. Key benefits Broad compatibility: aligns with standard SOP8 land patterns and assembly processes. Compact footprint: 150 mil body width supports dense PCB layouts and close component spacing. Easy integration: suitable for automated pickandplace and reflow soldering in typical manufacturing lines. Protective construction: encapsulated package protects the IC during handling and soldering. Consistent, predictable form factor: helps simplify design and planning across multiple devices. Specifications Style: SOP8150mil Package type: SOP8 Body width: 150 mil (approximately 3.81 mm) Leads: 8 Encapsulation material: plastic (typical for this style) Applications and use scenarios Consumer electronics: assemble small control or interface ICs on compact boards inside handheld devices, wearables, or home electronics. Development and prototyping: substitute standard SOP8 ICs on development boards or test fixtures with confidence in footprint compatibility. Industrial equipment: use in compact control modules, sensor interfaces, or logic circuits where footprint efficiency is important. Notes This description follows the SOP8150mil style specification and reflects standard expectations for an eightpin SOP package. For exact tolerances, lead finish, and thermal specifications, consult the specific part datasheet.