Features: 1. With strong continuous printing performance, it is suitable for fine pitch IC and BGA and comparative precision component soldering. 2. Good wettability, good resistance to cold, collapse, heat and dryness. 3. Applicable to a variety of high-demand materials PCB welding, fine pitch and high-precision components and few displacement phenomenon. 4. Bright tin beads, few residue and it's white and transparent, and there is no strong corrosive substance such as fluorine. 5. Excellent quality and durability. Specifications: Product: Low Temperature Solder Paste Model: SFD-226/227 Composition: sn965/Ag3/Cu0.5 Particle: 25-38um (No. 4 powder) Weight: 42g/tube, 60g/can Applicable: mobile phone hard disk CPUI, etc. Melting point: 138° Size: about 40*30*30MM (canned)/1.57*1.18*1.18in Size: about 100*35*30MM (tube installed)/3.93*1.38*1.18in Package List: 1 * Solder Paste 1、With strong continuous printing performance, it is suitable for fine pitch IC and BGA and comparative precision component soldering. 2、Good wettability, good resistance to cold, collapse, heat and dryness. 3、Excellent quality and durability. 4、Applicable to a variety of high-demand materials PCB welding, fine pitch and high-precision components and few displacement phenomenon. 5、Bright tin beads, few residue and it's white and transparent, and there is no strong corrosive substance such as fluorine.