Features: Engineered for optimal thermal management, this aluminum heatsink set reduces processor temperatures, ensuring stable performances for Raspberry B 2, 3, 4 and development boards under heavy workloads. Crafted from lightweight yet durability aluminum alloy, the heatsink features quality thermal adhesive tape for easy installation in confined space while maintaining structural integrity. Ideal for electronics enthusiasts, developers, and professional engineers working on microcontroller projects, power modules, or LED driver systems requiring efficient heat dissipation solution. Perfect for high load computing environments, industrial automation setups, and prototyping labs where sustained component temperatures threaten device reliability and operational efficiency. The heat sink is equipped with high-performances thermal conductivity adhesive, high viscosity, durability and long lasting. Specifications: Type: Development board heat sink Component: Aluminum for Raspberry B 2, 3, 4,Heatsink Multiple Size as Picture Show; Applicable: for Development Board Heat Dissipation; Package Includes: 100pcs Heatsink note: Please allow 1-3cm errors due to manual measurement. Due to the differences between different monitors, the picture may not reflect the actual item color.