Features: 1.300℃ high temperature resistant in the short term, 250℃ high temperature resistant for a long time. 2.High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat resistant adhesive tape to work for a very long time. 3.High insulation ensures the safety. 4.Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling. 5.33m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding. Specification: Color: amber Product type: Tape Thickness: approx. 0.06mm Stretch ability: ≥35% Peel strength: 5N/25mm Tensile force: 135N/25mm Temperature resistant: Long time: 250℃; Short time: 300℃ Package List: 1 x Tape Note: Please allow slight deviation for the color and measurement. Thanks for your understanding. 1、300℃ high temperature resistant in the short term, 250℃ high temperature resistant for a long time. 2、High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat resistant adhesive tape to work for a very long time. 3、High insulation ensures the safety. 4、Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling. 5、33m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding.